Hoʻoponopono i ka wela a me ka haʻahaʻa

Hoʻoholo nui ʻia ka mahana a me ka haʻahaʻa o ka lumi maʻemaʻe e like me nā koi o ke kaʻina hana, akā ma lalo o ke ʻano o ka hoʻokō ʻana i nā koi o ke kaʻina hana, pono e noʻonoʻo ʻia ka hōʻoluʻolu kanaka.Me ka piʻi ʻana o nā koi hoʻomaʻemaʻe ea, aia ke ʻano o ke kaʻina hana i ʻoi aku ka nui o nā koi i ka mahana a me ka haʻahaʻa.

Ke hele nei ka ʻoi aku ka maikaʻi o ka mīkini, ʻoi aku ka liʻiliʻi a me ka liʻiliʻi o nā koi no ka pae hoʻololi wela.No ka laʻana, ma ke kaʻina hana hoʻolaha lithography o ka hana kaapuni hoʻohui nui, ʻo ka ʻokoʻa ma waena o ka coefficient hoʻonui wela o ke aniani a me ka wafer silika e like me ka mea o ka diaphragm pono e liʻiliʻi a liʻiliʻi.ʻO ka wafer silika me ke anawaena o 100μm e hoʻonui i ka laina laina o 0.24μm ke piʻi ka mahana ma ka 1 degere.No laila, pono e loaʻa kahi mahana mau o ± 0.1 degere.I ka manawa like, ʻoi aku ka haʻahaʻa o ka haʻahaʻa haʻahaʻa, no ka mea, ma hope o ka hū ʻana o ke kanaka, e haumia ka huahana, ʻoi aku hoʻi No nā hale hana semiconductor e makaʻu nei i ka sodium, ʻaʻole pono kēia ʻano hale hana maʻemaʻe ma mua o 25 degere.

ʻO ka haʻahaʻa haʻahaʻa ke kumu o nā pilikia.Ke ʻoi aku ka haʻahaʻa haʻahaʻa ma mua o 55%, e kū ka condensation ma ka paia o ka paipu wai hoʻomaha.Inā loaʻa ia i loko o kahi hāmeʻa pololei a i ʻole kaapuni, e hoʻokau ʻia ia i nā pōʻino like ʻole.He maʻalahi ka ʻōpala inā ʻo 50% ka haʻahaʻa haʻahaʻa.Eia kekahi, ke kiʻekiʻe loa ka haʻahaʻa, e hoʻopili ʻia ka lepo ma luna o ka ʻili o ka wafer silicon e nā molekele wai i ka lewa i ka ʻili, he mea paʻakikī ke wehe.ʻOi aku ka kiʻekiʻe o ka haʻahaʻa pili, ʻoi aku ka paʻakikī o ka wehe ʻana i ka adhesion, akā inā ʻoi aku ka haʻahaʻa o ka haʻahaʻa haʻahaʻa ma mua o 30%, ʻoi aku ka maʻalahi o nā ʻāpana ma ka ʻili ma muli o ka hana o ka ikaika electrostatic, a me ka nui o nā semiconductor. hiki i nā mea hana ke wāwahi.ʻO ka pae wela maikaʻi loa no ka hana wafer silika he 35 ~ 45%.